HYDERABAD, India  — Refroid Technologies, India’s pioneer in indigenous high-density liquid cooling, and Technavious Solutions Private Limited, a global mission-critical data centre engineering, commissioning, and certification firm, today announced a strategic partnership to deliver a validated “Brick-to-Chip” infrastructure framework for AI-ready data centres.

As AI workloads push compute densities to unprecedented levels, traditional air-cooled facilities are approaching their thermal limits. Next-generation processors are now exceeding 500W thermal design power (TDP), forcing operators to rethink how infrastructure is designed, cooled, and validated. The Refroid–Technavious alliance addresses this challenge by combining Refroid’s advanced liquid cooling technologies with Technavious’s specialised MEP (Mechanical, Electrical and Plumbing) design, commissioning and TIA-942 certification expertise.

Bridging the Hardware-Infrastructure Engineering Gap

• The partnership provides a comprehensive infrastructure roadmap across two distinct technical tracksHyperscale DLC Integration: Technavious will integrate Refroid’s Sentraflo Coolant Distribution Units (CDUs) into hyperscale facility blueprints. This ensures that secondary liquid loops are engineered for optimal flow stability, thermal efficiency, and redundancy. This enables data centres to support large-scale GPU clusters while maintaining the reliability standards required for hyperscale AI infrastructure.
• Sovereign Immersion for Enterprise Edge: For captive data centres and remote edge nodes, the partnership offers self-contained Liquid Immersion Cooling Pods. Technavious provides the site-readiness engineering to deploy these systems within existing facilities, enabling high-density AI compute without expensive facility retrofits.

Solving the “Commissioning Gap”

A cornerstone of the collaboration is the integration of Refroid’s Hybrid Load Banks into Technavious’s Level 1–7 commissioning lifecycle. This addresses a major challenge in high-density AI deployments: validating cooling and power infrastructure before installing expensive IT hardware. The approach enables Level 5 Integrated System Testing (IST) by accurately simulating both liquid and air thermal loads, allowing operators to verify system performance and resilience prior to production deployment.

“Standardizing liquid cooling requires more than just hardware; it requires a rigorous, auditable engineering lifecycle,” said Satya Bhavaraju, CEO of Refroid Technologies. “By pairing our indigenous DLC and Immersion hardware, powered by our dielectric fluids co-developed with BPCL, with Technavious’s commissioning authority, we are giving operators the certainty that their infrastructure is ready for the next decade of AI. This is how we put Indian thermal engineering on the global map.”

“Our mission is to ensure the reliability and auditability of mission-critical facilities,” said Senthil Kumar R, CEO of Technavious Solutions. “By incorporating Refroid’s liquid-ready technology into our TIA-942 compliant designs, we can now offer a sovereign, ‘Make in India’ pathway to highly efficient liquid-cooled AI infrastructure, designed to achieve ultra-low PUE levels even in challenging ambient conditions. This partnership bridges the gap between ambitious AI goals and functional, high-efficiency reality.”